Datacon 2200EvoPlus. Datacon EVO 2200 Plus. Esec 2100 Die Bonding. A Bonder for manual or automatic bonding. Bondjet BJ820. Fiber-optic and electronics manufacturing equipment and materials. Chalman Technologies. Over 30 years experience selling semiconductor, fiber-optic, and microelectronic materials. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.
This DATACON / BESI 2200 Evo has been sold.
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ID#: 9115929Model:
2200 EvoWafer Size:
8'Datacon 2200 Evo Manual Online
Die attacher, 8'In-line SMEMA configuration
Hard disk upgraded to SSD
Spare parts included
Equipment module:
Dynamic XYZ theta servo motors: yes
Theta axis rotary bond-head: yes
Programmable lighting systems with RGB light: yes
Datacon pattern recognition system with edge, pattern, and ink-dot recognition:
Programmable
IPU
CMOS Substrate camera/optics/illumination: Yes
Upward looking camera: Yes
Downward looking camera: Yes
Wafer camera: Yes
Programmable bond force (up to 7000 grams): Yes
Bond force sensor and mini-BMC kit: Yes
Ionizer:
Main axis: Yes
Substrate transport system:
Current transport system configuration:
Heated stage of up to 150 DC temperature
Flatboat configuration
BETS (Belt Elevation TS)
Belt classic transport system:
BETS
Component presentation system:
Wafer lifter and changer: Yes
Wafer table with stretcher: Yes
Additional frame down-holding application for 8' and 12' wafer:
Adaptor for 8'
Wafer frame adapter for automatic change: Yes
Wafer ring adapter for automatic change: Hoop ring adaptor
Waffle pack (Gel pack) holder 2':
Waffle pack adaptor
Separate gel-pack adaptor
Waffle pack (Gel pack) holder 4':
Waffle pack adaptor
Separate gel-pack adaptor
Tape and reel presentation: No
SEMS / GEMS Compliant: Capable but not activated
Input / Output system:
Magazine handler:
SMEMA Ready
I/O equipment: No
Die handling system:
Automatic tool changer unit 7-slot: Yes
Tool holders and tools:
Standard tool holder (shank and tip): Yes
Ejector system:
Single-chip ejector unit: Yes
Upgrade to multi-chip ejection carousel: Yes
Eject tool base: Yes
Needle kit: No
Epoxy application system:
Dispenser-pressure/time:
Time / Pressure
Volumetric pump
Epoxy stamping system:
Time / Pressure
Volumetric pump
Auger or positive displacement:
Configured based on solar product
Flip chip station
Automatic tool changer:
(7) Slots
Die attach
Flip chip capability
ID Axis
Jetter system: Yes
Built-in vacuum pump: Disconnected, but available
Heated stage (150°C): Yes
Vision system with up and down looking cameras
Placement accuracy: 10 µm (3 sigma)
Programmable bond force (7000 grams)
Die pick from wafer, waffle pack, gel pack - Wafer up to 12” with 8' adapter
Waffle pack / Gel-Pak® 2” x 2” and 4” x 4”
Substrate working range: 8'
ID Integrated dispenser for classic transport system
Dispenser volumetric screw pump (ID Axis)
P-Part for automatic transport system (for ID axis)
Calibration tool kit: No
208V/220V Power compatibility: 3Phase - 400V
Machine software installation disk: No
Integrated dispenser
Vision alignment
Pick & place head
X / Y Placement accuracy: ± 7 μm @ 3s
Theta placement accuracy: ± 0.15° @ 3s
Die attach: Disconnected
Heated bond head and plate
Standard bond head: 0° - 360° Rotation
Equipment operating and maintenance manual or CD-ROM: Yes
CE Marked
Currently crated
2008 vintage.
